high bandwidth memory
Infrastructure & Cloud
Samsung HBM4: The Memory Chip Powering AI’s Next Performance Leap
April 13, 2026
Samsung ships the first HBM4 with 3.3TB/s bandwidth and up to 48GB capacity via 16-layer stacking. The Samsung-SK Hynix race defines AI chip speed.
Infrastructure & Cloud
Samsung’s 755% Profit Surge: How HBM Chips Became AI’s Critical Bottleneck
April 9, 2026
Samsung's 755% profit surge driven by HBM memory chips reveals how AI infrastructure demand created a critical bottleneck.
